生产 FPC环氧线路板高温保护膜 PI覆盖膜/PI热压覆盖膜

 PI覆盖膜 FPC高温保护膜 热压粘合保护膜 柔性线路板高温膜：

基材：PI膜

胶水：热熔胶

热固化型纯胶(Adhesive Film)是以日本进口高耐热、高黏着力的环氧改性丙烯酸树脂黏胶所制成，厚度从0.012mm至0.075mm。在胶膜上下分别有一片离型膜保护，对于一般金属与PI等塑料膜具有优良的热贴合性质，并适用于一般的加工设备钻孔、冲制、裁切、焊锡等加工程序，可应用在软性印刷电路板的热压合、厚PI膜、SUS不锈钢板、FR4基板的黏结、软硬板及各种金属板的结合、或是各种组件的承载等，寿命长，耐候性佳，并具长期使用上的优势，是**的热固化型纯胶胶膜。

具有下属特性:

 优异的耐高温性(能耐260度锡焊加工)和耐低温性
**的尺寸稳定性和较低的吸水率特性
**的粘接强度,能适用2-Layer/3-Layer产品的热压贴合
优越的电气绝缘特性

Bonding sheet is a kind of high performance epoxy-based adhesive which formulated for the requirement of anti-migration, weatherbility, flexibility, flammability, and heat resistance. Bonding sheet is especially designed to made a balance between the highest peel strength needs and easy-operating when laminating. It is an ideal adhesive material for PCB、FPC or similar application.

1、加工方法简单
滚筒层压和后固化的粘接简单易行.
Easy to Process by Roll Lamination plus Postcure.

2.具有优异的耐湿性能
Excellent Moisture Resistance.

3.应用在聚酰ya胺薄膜基材和柔性印刷电路板的粘接.
Appropriate for Bonding Polyimide film Base FPC to Stiffener

4.保存期限长